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1

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading

Li, Jue, Broas, Mikael, Raami, Jani, Mattila, Toni T., Paulasto-Kröckel, Mervi

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.78 MB

english, 2014

2

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Methods for reliability assessment of MEMS devices — Case studies of a MEMS microphone and a 3-axis MEMS gyroscope

Hokka, J., Raami, J., Hyvonen, H., Broas, M., Makkonen, J., Li, J., Mattila, T. T., Paulasto-Krockel, M.

Year:

2012

Language:

english

File:

PDF, 1.40 MB

english, 2012

3

Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope

Li, Jue, Broas, Mikael, Makkonen, Joonas, Mattila, Toni T., Hokka, Jussi, Paulasto-Krockel, Mervi

Journal:

Journal of Microelectromechanical Systems

Year:

2014

Language:

english

File:

PDF, 1.60 MB

english, 2014

4

Flip chip die attach development for multichip mechatronics power packages

Paulasto-Krockel, M., Hauck, T.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2001

Language:

english

File:

PDF, 270 KB

english, 2001

5

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vuorinen, Vesa, Ross, Glenn, Viljanen, Heikki, Decker, James, Paulasto-Krockel, Mervi

Year:

2018

File:

PDF, 730 KB

2018

6

Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment

J.S. Karppinen, J. Li, T.T. Mattila, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.24 MB

english, 2010

7

Toward comprehensive reliability assessment of electronics by a combined loading approach

T.T. Mattila, M. Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.94 MB

english, 2011

8

Shock impact reliability characterization of a handheld product in accelerated tests and use environment

J. Karppinen, J. Li, J. Pakarinen, T.T. Mattila, M. Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.99 MB

english, 2012

9

The reliability of component boards studied with different shock impact repetition frequencies

Jussi Hokka, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.39 MB

english, 2012

10

Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading

T. Laurila, J. Karppinen, J. Li, V. Vuorinen, M. Paulasto-Kröckel

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 1001 KB

english, 2013

11

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Jue Li, Markus Turunen, Sini Niiranen, Hongtao Chen, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

12

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Toward comprehensive reliability testing of electronic component boards

Mattila, T. T., Paulasto-Krockel, M.

Year:

2010

Language:

english

File:

PDF, 2.58 MB

english, 2010

13

The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies

Karppinen, J. S., Li, J., Paulasto-Krockel, M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013

14

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

Mattila, Toni T., Hokka, Jussi, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 8.21 MB

english, 2014

15

[Microsystems] Interfacial Compatibility in Microelectronics || Interfacial Adhesion in Polymer Systems

Laurila, Tomi, Vuorinen, Vesa, Paulasto-Kröckel, Mervi, Turunen, Markus, Mattila, Toni T., Kivilahti, Jorma

Year:

2012

Language:

english

File:

PDF, 535 KB

english, 2012

16

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Void formation in Cu-Sn micro-connects

Ross, Glenn, Vuorinen, Vesa, Paulasto-Krockel, Mervi

Year:

2015

Language:

english

File:

PDF, 1.46 MB

english, 2015

17

Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Rautiainen, Antti, Xu, Hongbo, Österlund, Elmeri, Li, Jue, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 3.12 MB

english, 2015

18

Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

Dong, H.Q., Vuorinen, V., Liu, X.W., Laurila, T., Li, J., Paulasto-Kröckel, M.

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

19

Void formation and its impact on CuSn intermetallic compound formation

Ross, Glenn, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 3.89 MB

english, 2016

20

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Rautiainen, Antti, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 3.88 MB

english, 2017

21

Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Dong, Hongqun, Vuorinen, Vesa, Laurila, Tomi, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.67 MB

english, 2016

22

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M., Paulasto-Kröckel, M.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.84 MB

english, 2017

23

Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Rautiainen, Antti, Vuorinen, Vesa, Heikkinen, Hannele, Paulasto-Krockel, Mervi

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.80 MB

english, 2018

24

Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces

Österlund, Elmeri, Suihkonen, Sami, Ross, Glenn, Torkkeli, Altti, Kuisma, Heikki, Paulasto-Kröckel, Mervi

Journal:

Journal of Crystal Growth

Year:

2020

Language:

english

File:

PDF, 2.12 MB

english, 2020

25

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

T. Laurila, V. Vuorinen, M. Paulasto-Kröckel

Journal:

Materials Science and Engineering: R: Reports

Year:

2010

Language:

english

File:

PDF, 3.21 MB

english, 2010

26

Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers

T. Laurila, J. Karppinen, V. Vuorinen, A. Paul, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 544 KB

english, 2011

27

Thermodynamic assessment of Au–Ho and Au–Tm binary systems

H.Q. Dong, X.M. Tao, T. Laurila, M. Paulasto-Kröckel

Journal:

Year:

2012

Language:

english

File:

PDF, 568 KB

english, 2012

28

Simulation of dynamic recrystallization in solder interconnections during thermal cycling

J. Li, H. Xu, T.T. Mattila, J.K. Kivilahti, T. Laurila, M. Paulasto-Kröckel

Journal:

Computational Materials Science

Year:

2010

Language:

english

File:

PDF, 1.36 MB

english, 2010

29

Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test

Jue Li, Tapio Tarvainen, Jaana Rich, Markus Turunen, Mervi Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 703 KB

english, 2012

30

The Combined Effect of Shock Impacts and Operational Power Cycles on the Reliability of Handheld Device Component Board Interconnections

J.S. Karppinen, T. Laurila, T.T. Mattila, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.61 MB

english, 2012

31

Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

T. Laurila, J. Karppinen, V. Vuorinen, J. Li, A. Paul, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.61 MB

english, 2012

32

Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels

Abdul-Quadir, Yasir, Laurila, Tomi, Karppinen, Juha, Paulasto-Kröckel, Mervi

Journal:

International Journal of Energy Research

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

33

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability assessment of a MEMS microphone under shock impact loading

Li, J., Makkonen, J., Broas, M., Hokka, J., Mattila, T. T., Paulasto-Krockel, M., Meng, J., Dasgupta, A.

Year:

2013

Language:

english

File:

PDF, 1.86 MB

english, 2013

34

Thermodynamic modeling of Au–Ce–Sn ternary system

Dong, H.Q., Tao, X.M., Laurila, T., Vuorinen, V., Paulasto-Kröckel, M.

Journal:

Year:

2013

Language:

english

File:

PDF, 1.78 MB

english, 2013

35

Thermodynamic reassessment of Au–Cu–Sn ternary system

Dong, H.Q., Vuorinen, V., Tao, X.M., Laurila, T., Paulasto-Kröckel, M.

Journal:

Journal of Alloys and Compounds

Year:

2014

Language:

english

File:

PDF, 3.35 MB

english, 2014

36

Guest editorial

Liu, Johan, Paulasto-Kröckel, Mervi

Journal:

Advances in Manufacturing

Year:

2013

Language:

english

File:

PDF, 82 KB

english, 2013

37

Mitteilungen der DGRM

Liu, Johan, Paulasto-Kröckel, Mervi

Journal:

Year:

2013

Language:

german

File:

PDF, 526 KB

german, 2013

38

Wafer-level SLID bonding for MEMS encapsulation

Xu, H., Suni, T., Vuorinen, V., Li, J., Heikkinen, H., Monnoyer, P., Paulasto-Kröckel, M.

Journal:

Advances in Manufacturing

Year:

2013

Language:

english

File:

PDF, 816 KB

english, 2013

39

Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO 2 cathode material

Abdul-Quadir, Yasir, Laurila, Tomi, Karppinen, Juha, Jalkanen, Kirsi, Vuorilehto, Kai, Skogström, Lasse, Paulasto-Kröckel, Mervi

Journal:

International Journal of Energy Research

Year:

2014

Language:

english

File:

PDF, 1.77 MB

english, 2014

40

Thermodynamic reassessment of Au–Ni–Sn ternary system

Dong, H.Q., Vuorinen, V., Laurila, T., Paulasto-Kröckel, M.

Journal:

Year:

2013

Language:

english

File:

PDF, 4.30 MB

english, 2013

41

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections

Mattila, T. T., Xu, H., Ratia, O., Paulasto-Krockel, M.

Year:

2010

Language:

english

File:

PDF, 1.46 MB

english, 2010

42

Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

Xu, H., Vuorinen, V., Dong, H., Paulasto-Kröckel, M.

Journal:

Journal of Alloys and Compounds

Year:

2015

Language:

english

File:

PDF, 1.58 MB

english, 2015

43

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Effects of shock impact repetition frequency on the reliability of component boards

Hokka, J., Mattila, T. T., Paulasto-Krockel, M.

Year:

2011

Language:

english

File:

PDF, 2.43 MB

english, 2011

44

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs

Liu Chen,, Paulasto-Krockel, M., Frohler, U., Schweitzer, D., Pape, H.

Year:

2008

Language:

english

File:

PDF, 4.87 MB

english, 2008

45

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Reliability assessment of MEMS devices — A case study of a 3 axis gyroscope

Makkonen, Joonas, Broas, Mikael, Li, Jue, Hokka, Jussi, Mattila, Toni T., Paulasto-Krockel, Mervi

Year:

2012

Language:

english

File:

PDF, 2.23 MB

english, 2012

46

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - High-speed mechanical impact reliability of solder interconnections in high-power LEDs

Hokka, J., Caers, J.F.J.M., Zhao, X.J., De Jong, M., Peels, W., Sykes, B., Zhang, G.Q., Paulasto-Krockel, M.

Year:

2010

Language:

english

File:

PDF, 9.78 MB

english, 2010

47

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Formation of mechanical strains in the component board of a high-end handheld product during shock impact

Karppinen, J.S., Pakarinen, J., Li, J., Mattila, T.T., Paulasto-Krockel, M.

Year:

2010

Language:

english

File:

PDF, 1.97 MB

english, 2010

48

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Finite element modeling for reliability assessment of solder interconnections in a power transistor

Li, Jue, Karppinen, Juha, Laurila, Tomi, Vuorinen, Vesa, Paulasto-Krockel, Mervi

Year:

2012

Language:

english

File:

PDF, 6.78 MB

english, 2012

49

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

Vuorinen, V., Dong, H., Xu, H., Vahanen, S., Suni, T., Laurila, T., Paulasto-Krockel, M.

Year:

2012

Language:

english

File:

PDF, 825 KB

english, 2012

50

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal investigation of a battery module for work machines

Abdul-Quadir, Yasir, Heikkila, Perttu, Lehmuspelto, Teemu, Karppinen, Juha, Laurila, Tomi, Paulasto-Krockel, Mervi

Year:

2011

Language:

english

File:

PDF, 2.02 MB

english, 2011